Feature: Thermal properties, strong adhesion Used to paste heat sink with IC chips, and be cooling body with good thermal effect Specifications: Model: STARS-922 Thermal conductivity : >0.671 W/m-k Thermal resistance : <0.06 °C-in2/W Strength of connected buildings:1.5map Surface curing time 10MIN/25 DEGREE Net Weight: 5g Notes: Viscosity control better, with just a little more force to remove the heat sink (rotating around a few can be removed), removed after wipe clean with paper towels. Package Included: 1x STARS-922 Heatsink Plaster
